The three-phase $2.25 million Silicon Carbide (SiC) Packaging Prize—launched by the U.S. Department of Energy’s (DOE’s) Office of Electricity—invites competitors to propose, design, build, and test state-of-the-art SiC packaging prototypes that move the industry beyond its current state.
Silicon carbide has become transformational to the power industry in countless applications across the industrial, energy, and automotive segments. SiC devices are prime candidates for future high-performance power electronics due to their high breakdown voltage, low switching loss, and high-temperature operation.
However, conventional packaging techniques limit the performance of SiC power modules due to parasitic inductance and heat dissipation issues. To enable grid-based applications, SiC power modules need to be expanded to higher voltage and higher current ratings.
Could your team’s innovative prototype be the winning solution? Find more information about submission requirements, judging criteria, and other important prize details in the Official Rules document.
Phase 1 – Design Study
Competitors will describe their team, their plan to make progress toward SiC packaging, showcase their current prototypes, and provide evidence of their current metrics that are in alignment with the goals of the prize. The goal of this phase is to develop a set of design documents for a Phase 2 prototype which adheres to the requirements set.
Prizes: Up to 10 winners of $50,000 each
Phase 2 – Initial Demonstration
In Phase 2, winners from Phase 1 will showcase and demonstrate the advancements made during the prize competition in packaging solutions for SiC modules, meeting, exceeding, or making progress toward the Phase 2 performance metrics as outlined in the rules. This phase is designed to act as a milestone towards achieving the Phase 3 target with the goal of innovating towards an improvement over state-of-the-art packaging and creating transformative solutions.
Prizes: Up to 4 winners of $250,000 each
Phase 3 – Final Demonstration
Competitors will demonstrate an advancement in packaging solutions for SiC modules, meeting or exceeding the Phase 3 performance metrics as outlined in the rules. The goal of the final phase is to achieve the high voltage and high current targets, while continuing to innovate towards an improvement over state-of-the-art packaging and creating transformative solutions.
Prizes: Up to 1 winner of $750,000
Performance metrics required for each phase of the prize.
Performance Metrics* | ||
| Metric | Phase 2 Target | Phase 3 Target |
| Heat Flux** | 500 W/cm2 | 1,000 W/cm2 |
| Voltage Hold-Off*** | 4.5 kV | 10 kV |
| Current Handling | 1,500 A | 2,000 A |
| Switching Characteristics | dI/dt > 80 A/ns dV/dt > 100 V/ns Voltage Overshoot < 5% | dI/dt > 150 A/ns dV/dt > 150 V/ns Voltage Overshoot < 5% |
| Max Case Temperature | 85ºC | 85ºC |
| Demonstrated Operational Time | 90 minutes continuous at 20 kHz inductive switching | 90 minutes continuous at 20 kHz inductive switching |
* Benchmarked against a half-bridge module configuration with antiparallel diodes.
** Assumes liquid cooling.
*** Using commercially available die ≤1,700 V rated.
Join us on April 8 for an informational webinar to learn more about the SiC Packaging Prize. During the webinar, prize administrators will give an overview of the competition including key dates, submission requirements, scoring criteria, and prize pools. Plus, applicants will have an opportunity to ask questions during the live Q&A. Register today!
Can’t make the webinar? We’ve got you covered. A webinar recording will be made available on HeroX in the week following the live event.
Competitor Eligibility
The competition is open only to private entities (for-profits and nonprofits); nonfederal government entities such as states, counties, tribes, and municipalities; academic institutions; and individuals, subject to the requirements in the Official Rules.
For more the complete application process and instructions for competing, please read the Official Rules in the Resources tab.
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