The three-phase $2.25 million Silicon Carbide (SiC) Packaging Prize—launched by the U.S. Department of Energy’s (DOE’s) Office of Electricity—invites competitors to propose, design, build, and test state-of-the-art SiC packaging prototypes that move the industry beyond its current state.
Silicon carbide has become transformational to the power industry in countless applications across the industrial, energy, and automotive segments. SiC devices are prime candidates for future high-performance power electronics due to their high breakdown voltage, low switching loss, and high-temperature operation.
However, conventional packaging techniques limit the performance of SiC power modules due to parasitic inductance and heat dissipation issues. To enable grid-based applications, SiC power modules need to be expanded to higher voltage and higher current ratings.
Could your team’s innovative prototype be the winning solution? Find more information about submission requirements, judging criteria, and other important prize details in the Official Rules document.
Phases and Prizes
Phase 1 – Design Study
Competitors will describe their team, their plan to make progress toward SiC packaging, showcase their current prototypes, and provide evidence of their current metrics that are in alignment with the goals of the prize. The goal of this phase is to develop a set of design documents for a Phase 2 prototype which adheres to the requirements set.
Prizes: Up to 10 winners of $50,000 each
Phase 2 – Initial Demonstration
In Phase 2, winners from Phase 1 will showcase and demonstrate the advancements made during the prize competition in packaging solutions for SiC modules, meeting, exceeding, or making progress toward the Phase 2 performance metrics as outlined in the rules. This phase is designed to act as a milestone towards achieving the Phase 3 target with the goal of innovating towards an improvement over state-of-the-art packaging and creating transformative solutions.
Prizes: Up to 4 winners of $250,000 each
Phase 3 – Final Demonstration
Competitors will demonstrate an advancement in packaging solutions for SiC modules, meeting or exceeding the Phase 3 performance metrics as outlined in the rules. The goal of the final phase is to achieve the high voltage and high current targets, while continuing to innovate towards an improvement over state-of-the-art packaging and creating transformative solutions.
Prizes: Up to 1 winner of $750,000
Performance metrics required for each phase of the prize.
Performance Metrics*
Metric
Phase 2 Target
Phase 3 Target
Heat Flux**
500 W/cm2
1,000 W/cm2
Voltage Hold-Off***
4.5 kV
10 kV
Current Handling
1,500 A
2,000 A
Switching Characteristics
dI/dt > 80 A/ns
dV/dt > 100 V/ns
Voltage Overshoot < 5%
dI/dt > 150 A/ns
dV/dt > 150 V/ns
Voltage Overshoot < 5%
Max Case Temperature
85ºC
85ºC
Demonstrated Operational Time
90 minutes continuous at 20 kHz inductive switching
90 minutes continuous at 20 kHz inductive switching
* Benchmarked against a half-bridge module configuration with antiparallel diodes.
** Assumes liquid cooling.
*** Using commercially available die ≤1,700 V rated.
Informational Webinar
Join us on April 8 for an informational webinar to learn more about the SiC Packaging Prize. During the webinar, prize administrators will give an overview of the competition including key dates, submission requirements, scoring criteria, and prize pools. Plus, applicants will have an opportunity to ask questions during the live Q&A. Register today!
Can’t make the webinar? We’ve got you covered. A webinar recording will be made available on HeroX in the week following the live event.
Guidelines
Competitor Eligibility
The competition is open only to private entities (for-profits and nonprofits); nonfederal government entities such as states, counties, tribes, and municipalities; academic institutions; and individuals, subject to the requirements in the Official Rules.
For more the complete application process and instructions for competing, please read the Official Rules in the Resources tab.
We appreciate your patience while our team worked to release the announcement of Phase 1 winners. A modified version of the Official Rules document has been added to the Resources tab for all Phase 2 competitors to reflect this announcement delay. The change in the overall prize timeline has also been reflected in the Timeline tab.
We encourage you to review the Official Rules document in its entirety before submitting any Phase 2 materials.
This week, the U.S. Department of Energy’s Office of Electricity announced eight Phase 1 winners of the $2.25 million Silicon Carbide (SiC) Packaging Prize. Each of the following teams was awarded $50,000 in cash prizes and will move on to Phase 2 where they’ll spend the next year working toward prototype demonstrations that showcase their efforts to meet or exceed Phase 2 performance metrics.
Read more about the winning teams and their innovative approaches to create improvement over state-of-the-art packaging below.
Board Breakers(Fargo, North Dakota)
This team is creating a replacement of traditional power electronic modules by using additive manufacturing to print 3D ceramic packaging. Watch their 90-second submission summary video to learn more.
LincolnX(Lincoln, Nebraska)
This team plans to develop novel ultrafast and scalable SiC modules featuring dual orthogonal cooling to meet the prize goals and metrics. Watch their 90-second submission summary video to learn more.
Marel Power Solutions(Plymouth, Michigan)
This team plans to make packaging improvements through thermal management, three-dimensional mechatronic design, and a scalable arrangement of power switches. Watch their 90-second submission summary video to learn more.
NC Solar Inverters(Cary, North Carolina)
Using commercially available topside cooled discrete devices, this team will utilize their designed symmetric layout to maximize parasitic flying capacitance and minimize parasitic inductance. Watch their 90-second submission summary video to learn more.
NoMIS-Lux-QPT-UA(Albany, New York)
This team, comprised of NoMIS, Lux, QPT, and UofA, will combine their technology and products in Smart Metal Core SiC power blocks to create high voltage chip-scale packaging. Watch their 90-second submission summary video to learn more.
Stony Brook Power Packaging Team(Stony Brook, New York)
This team will develop high-voltage, high-current, fast-switching, and cost-effective modules and create a business entity for engineering sampling and commercialization. Watch their 90-second submission summary video to learn more.
Superior SiC Power Module Team(Gainesville, Florida)
This team plans to develop an interdisciplinary approach for SiC power modules with high-speed, high-energy efficiency, and low EMI. Watch their 90-second submission summary video to learn more.
Team Raiju - University of Arkansas(Fayetteville, Arkansas)
This team will embed 128 SiC die in LTCC controlled by an active dV/dt voltage balancer and cooled with integrated microchannel busbars. Watch their 90-second submission summary video to learn more.
Phase 2 of the SiC Packaging Prize will begin December 2024 and conclude in late 2025 after a 3-month prototype testing period at Oak Ridge National Laboratory. Due to a slight delay in the Phase 1 winner announcement, competitors should expect more information about an updated prize timeline soon.
Thank you to each team that applied for this prize!
The Silicon Carbide (SiC) Packaging Prize Phase 1 winner announcement has been delayed to mid-November. We apologize for this delay and appreciate your patience as our judging panel thoroughly reviews each submission. We encourage you to regularly check HeroX for any additional updates on this announcement.
Don’t forget the submission deadline for the SiC Packaging Prize is next Friday, Aug. 30, at 5 p.m. ET. Please consider uploading submission materials at least a few hours in advance to account for any potential technical difficulties.
As a reminder, the prize administrators highly recommend all applicants review the Official Rulesdocument in its entirety before submitting any materials.
Whether you're an individual with innovative ideas or a streamlined team of industry experts, there are opportunities to connect with other competitors through the HeroX Forum.
Simply make a post with the following information to notify other competitors that you're searching for a team/team member to apply with:
The name and email of you or your team captain
A short description of what type of team/teammate you're looking for
Your/your teams' areas of interest, capabilities, and experience.
As a reminder, all submission materials are due on Aug. 30 by 5 p.m. ET.
