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Submission
Haoyang Jiao's team
introduction
title
Electroplating of copper on perovskites
short description
develop an electroplating process to deposit copper on perovskite with high throughput
Submission Package
Link to your 90 second video (public)
https://youtu.be/M8Smju83NtM
Technical assistance request (public)
technical_assistance_request.pdf
Submission Summary Slide (public)
Summary.pdf